High Rate Dielectrics

HiTUS enables:

  • High rate deposition of dielectric materials; often providing faster rates than the pure metal
  • Thick deposition of dielectrics

HiTUS uses a remote plasma generation that results in a uniform, high ion density plasma at the target surface. As the target surface is uniformly eroded, the target maintains a metallic state even in the addition of gases such as oxygen or nitrogen (required for the reactive deposition of dielectric materials). The sputter yield from a metal is higher than that from a compound, thus HiTUS dielectric deposition rates are up to ten times faster than those of conventional sputtering.


If you would like to discuss your trial requirements, obtain costing, turnaround times, or for any other questions, we would love to hear from you.