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In all
cases the HiTUS process delivers very high quality thin film materials
with near ideal physical properties, very low stress and excellent
adhesion – whether on metal, glass or plastic substrates.
HiTUS also delivers
a significantly increased process scope, through the ability to
independently control target voltage and current and a capability
to operate outside of conventional sputter deposition ‘process
space’ – thereby providing an ‘enabling technology’
for new applications.
HiTUS technology
has proved to be especially beneficial for:
- High rate
reactive deposition for dielectric material deposition –
near ideal RI and electrical breakdown
- High rate
deposition of magnetic materials using thick targets (up to 15mm
thick at present)
- Stable stoichiometric
film deposition from compound, alloyed or mixed material targets
- Low temperature
deposition for plastic or other ‘delicate’ substrates
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