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PQL's Differentiators

Plasma Quest unique HiTUS sputter deposition equipment enables us to deposit a phenomenal range of thin film coatings tuned for a specific application. This is facilitated by the independent control of the plasma ion density and the ion energy that enables an unparalleled range for the deposition variables in addition to our expertly configured geometry that makes the most of our exceptional plasma processes. Only by using the Plasma Quest approach are you able to produce a single thin film coating with this level of control and quality. Specific key differentiators are listed below.
In addition to our excellent thin film material properties, PQL also take huge pride in our quality of service. PQL has been established since 1997 and focused exclusively on achieving the very highest quality thin film coatings using the HiTUS process. Our thin film coating experts are able to answer any of your questions regarding the vacuum sputter deposition process and provide insight regarding the material choices and end configuration for customer applications. We enable an intimate discussion with the PhD level experts who will guide you through your interaction with Plasma Quest if you just have questions, want to use our R&D coating service or wish to purchase our sputter deposition equipment. Furthermore, our size as a company enables us to respond rapidly to customer demands and shifting requirements. We offer nothing but the highest quality of thin film coatings and excellent customer service.
Key Material Differentiators Include:
- Wide Range of Material Coatings - The HiTUS process is capable of depositing a huge range of materials from metals such as Aluminium, Gold and Copper, through semiconductors such as silicon and zinc oxide to dielectrics and insulators such as alumina, hafnia and iron garnets
- Controllable Thin Film Stress - The level of internal stress in our thin film coatings can be controlled by the changing the process parameters to enable films with compressive, tensile or zero stress.
- High Thin Film Deposition Rate - The control of the ion energy and ion density provides a wide range of deposition rates available. In particular, the HiTUS deposition can be used to deposit films with very high rates, >250nm/min for alumina.
- Densification of Coatings - The interaction of the target atoms with the high-density plasma en route to the substrate enables increased adatom mobility at the surface resulting in higher density films with optical refractive indices close to bulk.
- High Adhesion of Coatings - In addition to the increased adatom mobility induced by the interaction with the plasma, the plasma can be used to "plasma clean" the surface prior to deposition of the thin film coatings. These combined result in high levels of adhesion and examples include noble metals such as gold onto plastics passing tape-tests.
- Low Temperature Depositions - The geometry of the system and the increased material properties require less energy to produce high quality materials. Substrates frequently require no substrate heating or post-process anneal. This enables coatings onto low temperature plastics such as PET.
- High Target Utilisation - The ions used for deposition are generated over the whole of the target providing full target utilisation and no racetrack as seen in magnetron deposition.
- Reactive Deposition Control - The high target utilisation and the geometry of the HiTUS configuration enables very stable reactive depositions without the requirement for feedback. This enables high rate dielectrics to be deposited from metal
- Thick Magnetic Materials - The HiTUS approach does not require local magnets behind the target. This means that normal depositions to be completed on thick ferromagnetic materials improving both the deposition rates and up time for these materials.
- Strong links with leading academic centres of excellence - with 3 post graduate students employed on site for much of the time. Our academic links additionally give us access to more specialised analytical equipment, usually on very fast turnaround.

