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PQL's Differentiators

Remotely Generated Plasma – We have independent control of all process parameters including target voltage and ion current
Low Temperature Process - Low temperature deposition for plastic or other 'delicate' substrates
Stable High Rate Reactive Process - Virtual elimination of target poisoning since the surface of the target is uniformly eroded.
Stress Control – Due to our unique process we are able to control the stress if growing thin films from compressive through to tensile.
Potential for Multilayer Devices – PQL systems have the ability to deposit multilayer without breaking vacuum
Thick ferromagnetic targets – Ability to sputter from thick ferromagnetic targets
Substrate plasma-cleaning - Offering enhanced adhesion performance
Strong links with leading academic centres of excellence - with 3 post graduate students employed on site for much of the time. Our academic links additionally give us access to more specialised analytical equipment, usually on very fast turnaround.

